Mounting Equipment
Superior quality hot and cold mounting systems for every application.
Choosing the right mounting method depends on several factors.
Hot compression mounting is the most economical option on a per mount cost basis, however due to the compression force, may not be an option for samples with delicate structures unable to withstand the elements of heat and/or force of compression.
Cold mounting (where a mixture of resin is poured into a mold) may benefit from either vacuum (epoxy only) or pressurization to help eliminate and/or reduce bubbles, improving clarity and sample protection.
TechPress 3x™
Hot Mounting
This mounting method is chosen mostly for high volume output where the cost per mold is much lower than with cold resins. Typical output is two (2) mounts in about 8-10 minutes per cycle.
VacuPrep™
Cold Mounting
The VacuPrep™ vacuum impregnation system is used to remove bubbles from epoxy resins.
PC-200™
Cold Mounting
This pressure chamber is used to suppress the formation of bubbles when mounting with either epoxy or acrylic resins.
BL-100
Cold Mounting
The BL-100 is a blue (wavelength) light curing chamber used to cure one-part light (BL-Cure) curing resin.
Extraction Press
Cold Mounting
The Mount Extraction Press is used to help push out cured resin mounts from either 2-part or PCB mold cups.
Accessories
