X-Prep®

decorative

Precision Milling

Polishing System

The most advanced, intuitive, automated milling machine in the world.

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/pol-ishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

Unlike the typical CNC machine, the X-Prep® has a compact tabletop footprint that easily fits into the lab environment and is designed to minimize noise. Additionally, its 12″ touchscreen GUI enables an easy process-based workflow to control the system’s powerful functions – no programming knowledge required!

The key design components feature granite construction with a wide RPM range spindle (3,000–100,000 RPM), a high precision closed-loop Z-Control (2.4 nm encoder resolution and 0.1 N force control) and large X/Y range of motion (100 mm x 140 mm).

Made in the USA logo with American Flag

Features

  • 5-axis, specialized mechanical milling instrument for lab use  
  • Large color LCD touchscreen graphic user interface  
  • Easy-to-use, wizard-based workflow 
  • Closed-loop Z-axis force and position control  
  • Live HD video navigation to set X/Y milling/grinding/polishing region 
  • Automatic 3-point sample leveling  

Related Products

picture of the X-Prep Vision. By clicking this photo it takes you to the X-Prep Vision product page.

X-Prep® Vision™

This system is a metrology tool enabling measurement of silicon and semitransparent substrates. It is necessary for 3D processing applications that require uniform thicknesses.

Learn about X-Prep® Vision™ >

Diamond Tools

Therse tools are for grinding non-metal alloys such as silicon, silicon carbide, and mineral/ silica-filled resins in molded electronic devices.

See Diamond Tools >

Mounts

Mounts are used in conjunction with grinding discs or polishing pads/discs.

See Mounts >

Discs/Sheets

These plain back pads/cloths are secured to mounts using instant adhesive and used for polishing on the X-Prep®.

See Discs/Sheets >

decorative

Details

Parallel delayering of metalized IC using the Parallel Delayering Module.

Low force physical contact with ruby tipped leveling probe to measure Z position.

All screens feature graphic icons that assist in the visualization of tool motion to help with process setup.