MultiPrep™ System
Overview
Site-Specific Grinder/Polisher
The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation.
Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill.
Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.
Features
- Ideal for precise, quantitative semiautomatic preparation
- Utilizes either 8″ or 10″ (203 or 254 mm) platens
- Color LCD touchscreen to control all functions
- Digital indicator; displays real-time material removal, 1μm
- Dual axis adjustable micrometer positioning, 0.02° angle resolution
- Maintains geometric position of sample relative to abrasive plane
- Seamless integration with optional AD-5TM Fluid Dispenser
Video
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Details
Digital Indicators Enable Quantifiable Material Removal
7″ LCD Touchscreen
Easy to Read Micometer Heads Provide 0.02° Angle Adjustment for Sample Alignment/Correction