Semiconductor
Microstructural analysis is essential in semiconductor manufacturing for evaluating thin films, wafer cross-sections, and complex multilayer structures. Challenges include sectioning ultra-thin substrates, preserving delicate interfaces, and achieving mirror-flat surfaces for defect analysis and failure of investigation. Allied High Tech Products meets these demands with advanced solutions like the X-Prep® Precision Polishing System, designed for controlled material removal and high-accuracy planarization. Combined with our grinding and polishing workflows, X-Prep ensures repeatable, artifact-free surfaces — delivering the precision required for today’s semiconductor research and production.
Do you need an industry-specific technical application report?
- Ceramic Resistors
- Coated Gold Bond Wire Cross-Sections
- Electronic Device
- Electronic Devices with Silicone
- LED Cross-Sections
- Packages on a Circuit Board
- Parallel Lapping Integrated Circuits
- Silicon Angle Cross-Section
Small Package Cross-Section
Solder Ball on Integrated Circuit
Delayered Integrated Circuit
